KOREA TUNGSTEN CO.,LTD

AlN Heater (Mo)

AlN Heater

A high-temperature heater with a molybdenum element embedded in aluminum nitride (AlN) ceramic, for positions in semiconductor and display process chambers that require even temperature distribution and low particle generation.

200 W/m·K +Thermal conductivityAlN substrate / 25°C

190°C per secondMaximum ramp rateMeasured with no load

± 1 %Surface temperature deviationMeasured over the effective heating area

600 °C +Stable in continuous useVacuum chamber environment

200 W/m·K +Thermal conductivityAlN substrate / 25°C

190°C per secondMaximum ramp rateMeasured with no load

± 1 %Surface temperature deviationMeasured over the effective heating area

600 °C +Stable in continuous useVacuum chamber environment

Applied parts

The element pattern inside a high-precision flat AlN heater

Applied parts

A component for equipment used in AlN ceramic processes, semiconductor parts, high-current switches and high-frequency power amplifiers. The element pattern is designed and built to your requirement.

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Element wire diameterIn 0.1 mm steps

MaterialAlN (Mo element embedded)

Thermal conductivity200 W/m·K and above

Temperature uniformityWithin ± 1 %

Max heating rate190 °C / second

Resistance1 – 5 Ω (on request)

Pattern pitchAdjustable per zone

Values set by type and order — diameter (OD 50 – 500 mm), adjustable resistance, element wire diameter in 0.1 mm steps, pattern pitch, rated voltage and power, terminal type available on request.

No products added

No photos registered100 %Scroll to zoom · drag to pan

Element wire diameterIn 0.1 mm steps

MaterialAlN (Mo element embedded)

Thermal conductivity200 W/m·K and above

Temperature uniformityWithin ± 1 %

Max heating rate190 °C / second

Resistance1 – 5 Ω (on request)

Pattern pitchAdjustable per zone

Values set by type and order — diameter (OD 50 – 500 mm), adjustable resistance, element wire diameter in 0.1 mm steps, pattern pitch, rated voltage and power, terminal type available on request.

No products added

KEY FEATURES

Structure makes performance

Among ceramic heaters, how fast and how evenly the heat spreads is what decides yield. An AlN substrate with an embedded element solves both at once.

A cross-section with the Mo element placed between AlN substrates and sintered in one pass.

Ultra-precise pattern uniformity

Precision Pattern Uniformity

To eliminate temperature variation across the heater face, the element coil spacing and wire diameter are laid out uniformly without deviation.

Thermal expansion (CTE) optimization

Thermal Expansion Matching

Close-fit processing is applied so that no delamination or open circuit occurs through repeated high-temperature heating and rapid cooling.

Fine machining and hole tolerance control

Micro Machining & Hole Tolerance

We have the demanding ceramic and wire forming capability to machine sensor recesses and complex concentric patterns without damage.

How it differs from an ordinary ceramic heater

AlN (this product)200

Al₂O₃ ceramic20

Quartz1.4

Thermal conductivity W/m·K. The higher the figure, the faster and more evenly heat spreads.

Why this connects to yield

Heat that spreads slowly lengthens the heat-up time; heat that spreads unevenly creates process variation starting at the wafer edge. Both figures have to be good for reproducibility inside the chamber.

Particles and leakage

The element is enclosed in ceramic and never contacts the process gas. Even in corrosive gas environments, the risk of particle generation and leakage is low.

KEY FEATURES

Structure makes performance

Among ceramic heaters, how fast and how evenly the heat spreads is what decides yield. An AlN substrate with an embedded element solves both at once.

A cross-section with the Mo element placed between AlN substrates and sintered in one pass.

Ultra-precise pattern uniformity

Precision Pattern Uniformity

To eliminate temperature variation across the heater face, the element coil spacing and wire diameter are laid out uniformly without deviation.

Thermal expansion (CTE) optimization

Thermal Expansion Matching

Close-fit processing is applied so that no delamination or open circuit occurs through repeated high-temperature heating and rapid cooling.

Fine machining and hole tolerance control

Micro Machining & Hole Tolerance

We have the demanding ceramic and wire forming capability to machine sensor recesses and complex concentric patterns without damage.

How it differs from an ordinary ceramic heater

AlN (this product)200

Al₂O₃ ceramic20

Quartz1.4

Thermal conductivity W/m·K. The higher the figure, the faster and more evenly heat spreads.

Why this connects to yield

Particles and leakage

The element is enclosed in ceramic and never contacts the process gas. Even in corrosive gas environments, the risk of particle generation and leakage is low.

1 – 5ΩResistance range

0.1mmElement wire diameter step

VariablepitchPattern pitch adjustment

1 – 5ΩResistance range

0.1mmElement wire diameter step

VariablepitchPattern pitch adjustment

DESIGN PRECISION

Designed to the resistance you require

In a heater, resistance rather than geometry is what distinguishes the product. We take your required resistance and temperature distribution, then recalculate and redraw the wire diameter, pitch and zone layout. This is not a product you pick from a catalog; it is one that is calculated and made.

Even within the same “concentric” pattern, changing the wire diameter and pitch changes the resistance and the heating distribution. The same geometry name does not mean the same product.

1 – 5Ω range

Designed to your required resistance

We take the target resistance and supply power and work back to the element length and cross-sectional area. Exact figures are set after reviewing the service conditions.

0.1mm steps

Element wire diameter

A thicker wire means lower resistance and heat spread wider; a thinner one means stronger local heating. We set it in 0.1 mm steps to meet the target temperature distribution.

pitchVariable

Pattern pitch adjustment

In chambers where the edge temperature drops, the outer zone spacing is narrowed. Different pitches per zone control variation across the whole wafer.

We do not pick a specification, we develop it with you. (Give us the chamber dimensions and the target temperature and resistance, and we take it from pattern design through prototype verification.)

DESIGN PRECISION

Designed to the resistance you require

Even within the same “concentric” pattern, changing the wire diameter and pitch changes the resistance and the heating distribution. The same geometry name does not mean the same product.

1 – 5Ω range

Designed to your required resistance

We take the target resistance and supply power and work back to the element length and cross-sectional area. Exact figures are set after reviewing the service conditions.

0.1mm steps

Element wire diameter

A thicker wire means lower resistance and heat spread wider; a thinner one means stronger local heating. We set it in 0.1 mm steps to meet the target temperature distribution.

pitchVariable

Pattern pitch adjustment

In chambers where the edge temperature drops, the outer zone spacing is narrowed. Different pitches per zone control variation across the whole wafer.

We do not pick a specification, we develop it with you. (Give us the chamber dimensions and the target temperature and resistance, and we take it from pattern design through prototype verification.)

APPLICATIONS

Applications

Six fields where AlN heaters are actually used. The temperature uniformity and heating rate each process demands differ, so the element pattern is designed to match.

Semiconductor depositionUsed as the susceptor heater that heats the wafer uniformly in CVD and ALD processes.

DisplayThe heat source that heats and fixes organic particles onto the substrate in OLED and Micro-LED manufacture.

Semiconductor equipment partsApplied as high-cleanliness in-chamber heating parts, including integrated electrostatic chuck (ESC) assemblies.

Medical · DiagnosticsFitted in diagnostic modules that heat samples extremely fast, such as blood analyzers and PCR.

Research · AnalysisUsed as a precision heating stage in high-temperature laboratory equipment.

Surface treatmentApplied in surface treatment processes in high-temperature plasma and chemical gas environments.

CVD / ALDOLED depositionmedical diagnostics

APPLICATIONS

Applications

Six fields where AlN heaters are actually used. The temperature uniformity and heating rate each process demands differ, so the element pattern is designed to match.

Semiconductor depositionUsed as the susceptor heater that heats the wafer uniformly in CVD and ALD processes.

DisplayThe heat source that heats and fixes organic particles onto the substrate in OLED and Micro-LED manufacture.

Semiconductor equipment partsApplied as high-cleanliness in-chamber heating parts, including integrated electrostatic chuck (ESC) assemblies.

Medical · DiagnosticsFitted in diagnostic modules that heat samples extremely fast, such as blood analyzers and PCR.

Research · AnalysisUsed as a precision heating stage in high-temperature laboratory equipment.

Surface treatmentApplied in surface treatment processes in high-temperature plasma and chemical gas environments.

CVD / ALDOLED depositionmedical diagnostics

LEAD TIME

Fabrication and Lead Time

This is not a catalog item; it is made to drawing. Here is how it proceeds from inquiry to production.

STEP 01

Drawing received

Send us the chamber dimensions, diameter and thickness, rated voltage and power, and terminal positions. If you have no drawing, the service conditions alone are enough to start.

Reply within 1 day

STEP 02

Design review

We propose the element pattern and zone layout and review the temperature distribution. Where useful we propose geometry changes as well.

3 – 5 days

STEP 03

Sintering · machining

The element is embedded in the AlN substrate, sintered, and the terminal section machined.

By agreement, depending on the production schedule

STEP 04

Inspection · delivery

Surface temperature variation and insulation resistance are measured, and the part ships with a test report. Repeat orders to the same drawing skip the review stage.

By agreement, depending on the production schedule

Minimum quantity

From 1 piece

Varies with geometry and dimensions. Prototypes can be made from 1 piece.

Standard lead time

About 4 – 6 weeks

From drawing approval. A pattern change adds the design review period.

Supplied with it

Test report

Surface temperature variation and insulation resistance measurements are sent with the delivery.

LEAD TIME

Fabrication and Lead Time

This is not a catalog item; it is made to drawing. Here is how it proceeds from inquiry to production.

STEP 01

Drawing received

Send us the chamber dimensions, diameter and thickness, rated voltage and power, and terminal positions. If you have no drawing, the service conditions alone are enough to start.

Reply within 1 day

STEP 02

Design review

We propose the element pattern and zone layout and review the temperature distribution. Where useful we propose geometry changes as well.

3 – 5 days

STEP 03

Sintering · machining

The element is embedded in the AlN substrate, sintered, and the terminal section machined.

By agreement, depending on the production schedule

STEP 04

Inspection · delivery

Surface temperature variation and insulation resistance are measured, and the part ships with a test report. Repeat orders to the same drawing skip the review stage.

By agreement, depending on the production schedule

Minimum quantity

From 1 piece

Varies with geometry and dimensions. Prototypes can be made from 1 piece.

Standard lead time

About 4 – 6 weeks

From drawing approval. A pattern change adds the design review period.

Supplied with it

Test report

Surface temperature variation and insulation resistance measurements are sent with the delivery.

HANDLING

Handling precautions

These apply to refractory metals in general. Service life depends heavily on how the parts are handled.

This is a ceramic component. Handle with care — it can break if dropped or struck.

Rapid heating or cooling can crack the part through thermal shock. Follow the recommended ramp curve.

Keep the electrode terminals clean and avoid touching them with bare hands. Increased contact resistance causes local overheating.

Do not exceed the rated voltage or current. Doing so will break the heating element.

Store indoors in a dry place, keeping the moisture-barrier packaging intact.

If your installation or operating conditions are unusual, our engineers will review them in advance. Send a drawing or your process conditions and we will start by selecting the right material with you.