KOREA TUNGSTEN CO.,LTD

Tungsten Sputtering Target

Tungsten and molybdenum boats and crucibles for vacuum deposition and high-temperature melting. They are used where the vessel must not react with molten metal, and are built to your required shape and capacity.

99.95 % +Material purityIt reduces film contamination

To drawingShape machiningRound · Square · Rotary

Indium · diffusionBonding methodIt governs cooling efficiency

3,422 °CMelting point of tungstenIt withstands high power

99.95 % +Material purityIt reduces film contamination

To drawingShape machiningRound · Square · Rotary

Indium · diffusionBonding methodIt governs cooling efficiency

3,422 °CMelting point of tungstenIt withstands high power

Applied parts

Used as the evaporation source in vacuum coaters, the melting crucible in high-temperature furnaces and the vessel in crystal growth equipment. Material and shape are designed around what it will hold and at what temperature.

No photos registered100 %Scroll to zoom · drag to pan

MaterialTungsten (W) · Molybdenum (Mo)

Purity99.95 % and above

ProductionBonded after precision machining

GeometryRound · square · rotary

BondingIndium · diffusion bonding

Service environmentHigh-vacuum sputtering

Geometry, bonding and cleaning level are set by the equipment and the process. Tell us the drawing and the conditions and we will confirm and reply.

No products added

No photos registered100 %Scroll to zoom · drag to pan

MaterialTungsten (W) · Molybdenum (Mo)

Purity99.95 % and above

ProductionBonded after precision machining

GeometryRound · square · rotary

BondingIndium · diffusion bonding

Service environmentHigh-vacuum sputtering

Geometry, bonding and cleaning level are set by the equipment and the process. Tell us the drawing and the conditions and we will confirm and reply.

No products added

KEY FEATURES

Purity and bonding decide the yield

Impurities and bonding defects are film defects.

The bond between target and backing plate sets the cooling and the power limit.

High purity

High Purity

It reduces the impurities that mix into the film, controlling interconnect resistance and property variation.

Bond quality

Bonding Quality

A void in the bonded face overheats at that point and cracks the target.

Dimensional accuracy

Dimensional Accuracy

The mounting face has to be flat for stable cooling and discharge.

Melting points by material

Tungsten (W)3422

Molybdenum (Mo)2623

Aluminum (Al)660

Melting point °C. The higher the figure, the better it withstands high-power sputtering.

Why bonding

Sputtering power turns into heat. A poor bond traps that heat and the target cracks.

Reclaiming

A used target can be brought back into service by re-bonding. We judge that on the conditions.

KEY FEATURES

Purity and bonding decide the yield

Impurities and bonding defects are film defects.

The bond between target and backing plate sets the cooling and the power limit.

High purity

High Purity

It reduces the impurities that mix into the film, controlling interconnect resistance and property variation.

Bond quality

Bonding Quality

A void in the bonded face overheats at that point and cracks the target.

Dimensional accuracy

Dimensional Accuracy

The mounting face has to be flat for stable cooling and discharge.

Melting points by material

Tungsten (W)3422

Molybdenum (Mo)2623

Aluminum (Al)660

Melting point °C. The higher the figure, the better it withstands high-power sputtering.

Why bonding

Sputtering power turns into heat. A poor bond traps that heat and the target cracks.

Reclaiming

A used target can be brought back into service by re-bonding. We judge that on the conditions.

99.95% +Material purity

DrawingbasisMachined geometry

Indiumor diffusionBonding method

99.95% +Material purity

DrawingbasisMachined geometry

Indiumor diffusionBonding method

DESIGN PRECISION

Geometry set to the equipment

In a target, geometry and bonding are what distinguish the product.

In the same target, changing the bonding method changes the power it can withstand.

Drawingbasis

Machined geometry

We look at the mounting specification and the erosion profile together.

Indiumor diffusion

Bonding choice

Chosen in light of the power and cooling conditions.

Cleaninggrade

Surface control

The cleaning level is raised to reduce particles.

We do not pick a specification, we develop it with you. (Give us the equipment dimensions and the process power, and we will work out the geometry with you.)

DESIGN PRECISION

Geometry set to the equipment

In a target, geometry and bonding are what distinguish the product.

In the same target, changing the bonding method changes the power it can withstand.

Drawingbasis

Machined geometry

We look at the mounting specification and the erosion profile together.

Indiumor diffusion

Bonding choice

Chosen in light of the power and cooling conditions.

Cleaninggrade

Surface control

The cleaning level is raised to reduce particles.

We do not pick a specification, we develop it with you. (Give us the equipment dimensions and the process power, and we will work out the geometry with you.)

APPLICATIONS

Applications

The fields where targets are used. Geometry and bonding differ by process.

Semiconductor interconnectUsed in metal thin-film deposition for gates and interconnects.

DisplayUsed in TFT interconnect and electrode thin-film deposition.

Solar cellsUsed in electrode and reflective film deposition.

Optical coatingUsed in reflective and blocking film deposition.

Hard coatingUsed in wear-resistant coating of tools and parts.

Research equipmentMade as targets for small sputtering equipment.

Semiconductor interconnectdisplaysolar cellsoptical coating

APPLICATIONS

Applications

The fields where targets are used. Geometry and bonding differ by process.

Semiconductor interconnectUsed in metal thin-film deposition for gates and interconnects.

DisplayUsed in TFT interconnect and electrode thin-film deposition.

Solar cellsUsed in electrode and reflective film deposition.

Optical coatingUsed in reflective and blocking film deposition.

Hard coatingUsed in wear-resistant coating of tools and parts.

Research equipmentMade as targets for small sputtering equipment.

Semiconductor interconnectdisplaysolar cellsoptical coating

LEAD TIME

Fabrication and Lead Time

This product is made to your drawing. Here is the process, step by step.

STEP 01

Specification received

Send us the target dimensions, purity requirement and whether a backing plate is needed.

Reply within 1 day

STEP 02

Specification review

We review the sintering conditions, density and flatness criteria and propose a bonding method.

2 – 4 days

STEP 03

Sintering · machining · bonding

The sintered material is machined to the dimensions on the drawing and bonded to the backing plate.

By agreement, depending on the production schedule

STEP 04

Inspection · delivery

Purity, density and flatness are measured, and the part ships with a test report. Repeat orders to the same specification skip the review stage.

By agreement, depending on the production schedule

Minimum quantity

From 1 piece

Varies with dimensions and purity grade.

Standard lead time

About 4 – 6 weeks

From drawing approval. Bonding adds to the period.

Supplied with it

Test report

Purity, density and flatness measurements are sent with the delivery.

LEAD TIME

Fabrication and Lead Time

This product is made to your drawing. Here is the process, step by step.

STEP 01

Specification received

Send us the target dimensions, purity requirement and whether a backing plate is needed.

Reply within 1 day

STEP 02

Specification review

We review the sintering conditions, density and flatness criteria and propose a bonding method.

2 – 4 days

STEP 03

Sintering · machining · bonding

The sintered material is machined to the dimensions on the drawing and bonded to the backing plate.

By agreement, depending on the production schedule

STEP 04

Inspection · delivery

Purity, density and flatness are measured, and the part ships with a test report. Repeat orders to the same specification skip the review stage.

By agreement, depending on the production schedule

Minimum quantity

From 1 piece

Varies with dimensions and purity grade.

Standard lead time

About 4 – 6 weeks

From drawing approval. Bonding adds to the period.

Supplied with it

Test report

Purity, density and flatness measurements are sent with the delivery.

HANDLING

Handling precautions

These apply to refractory metals in general. Service life depends heavily on how the parts are handled.

Do not touch the parts with bare hands after unpacking. Oil from fingerprints carbonizes at high temperature and becomes a contaminant.

The material is weak against impact and bending. Tungsten is brittle at room temperature and can crack if dropped.

Do not heat above 500°C in air; oxidation accelerates sharply. Always use the parts in a vacuum or an inert atmosphere.

Avoid rapid heating and cooling. On first use, we recommend pre-heating (aging) at low current.

Store indoors in a dry place and keep the moisture-barrier packaging intact.

If your installation or operating conditions are unusual, our engineers will review them in advance. Send a drawing or your process conditions and we will start by selecting the right material with you.