Alloys

KOREA TUNGSTEN CO.,LTD

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Alloys

Materials in which elements are added to refractory metals to make up for the limits of the pure metal. They secure the characteristics a given application needs — recrystallization suppression, high-temperature strength, machinability — and are used as precision parts in the semiconductor, display and energy industries.

8Supply combinations

70:30The standard WCu composition

90~97%WNiFe tungsten content

INTRODUCTION

Where a pure metal does not answer the conditions, alloys and composites take over. We set strength, conductivity and thermal expansion through the composition ratio.

WCuWAgWNiFeWNiCuLa-MoTZMMoCu

INTRODUCTION

Alloys

Where a pure metal does not answer the conditions, alloys and composites take over. We set strength, conductivity and thermal expansion through the composition ratio.

WCuWAgWNiFeWNiCuLa-MoTZMMoCu

WHY ALLOY

A material tuned to performance through its composition

01

Strength and conductivity at once

W-Cu and W-Ag give the arc resistance of tungsten and the conductivity of copper or silver in one part.

02

Thermal expansion matched to the design value

Changing the W:Cu ratio matches the expansion coefficient to ceramics and semiconductor chips.

03

Better machinability

TZM and La-Mo have higher high-temperature strength and recrystallization temperature than pure molybdenum.

KEY PROPERTIES

Key Properties

W-Cu

W 50–90% · 12.2–17.0 g/cm³

Thermal conductivity 180–340 W/m·K · composite for heat dissipation and electrodes

Mo-Cu

Mo 50–90% · 9.5–10.0 g/cm³

Thermal conductivity 150–270 W/m·K · helium leak ≤5×10⁻⁹ Pa·m³/s

Tungsten heavy alloy

W 90–97% · 16.9–18.9 g/cm³

ASTM B777 Class 1–4 · tensile ≥648–758 MPa, magnetic and non-magnetic

W-Ag

70:30

Composite for switching contacts

W-Re

WRe3/25 · WRe5/26

Thermocouple wire Ø0.10–1.00 mm · compensating wire included

TZM

Ti-Zr-Mo · oxygen below 50 ppm

Tensile 370 MPa at 1200°C · raised recrystallization temperature

MHC

Mo-Hf-C

A grade above TZM · tensile 300 MPa at 1400°C

La-Mo

La 0.1–2.0%

Improved high-temperature creep resistance

The compositions and properties listed are the range we can supply. W-Cu and Mo-Cu are made to order at any ratio where x + y = 100, and final feasibility depends on quantity, tolerance and material condition.

WHY ALLOY

A material tuned to performance through its composition

01

Strength and conductivity at once

W-Cu and W-Ag give the arc resistance of tungsten and the conductivity of copper or silver in one part.

02

Thermal expansion matched to the design value

Changing the W:Cu ratio matches the expansion coefficient to ceramics and semiconductor chips.

03

Better machinability

TZM and La-Mo have higher high-temperature strength and recrystallization temperature than pure molybdenum.

KEY PROPERTIES

Key Properties

W-Cu

W 50–90% · 12.2–17.0 g/cm³

Thermal conductivity 180–340 W/m·K · composite for heat dissipation and electrodes

Mo-Cu

Mo 50–90% · 9.5–10.0 g/cm³

Thermal conductivity 150–270 W/m·K · helium leak ≤5×10⁻⁹ Pa·m³/s

Tungsten heavy alloy

W 90–97% · 16.9–18.9 g/cm³

ASTM B777 Class 1–4 · tensile ≥648–758 MPa, magnetic and non-magnetic

W-Ag

70:30

Composite for switching contacts

W-Re

WRe3/25 · WRe5/26

Thermocouple wire Ø0.10–1.00 mm · compensating wire included

TZM

Ti-Zr-Mo · oxygen below 50 ppm

Tensile 370 MPa at 1200°C · raised recrystallization temperature

MHC

Mo-Hf-C

A grade above TZM · tensile 300 MPa at 1400°C

La-Mo

La 0.1–2.0%

Improved high-temperature creep resistance

WHY ALLOY

A material tuned to performance through its composition

01

Strength and conductivity at once

W-Cu and W-Ag give the arc resistance of tungsten and the conductivity of copper or silver in one part.

02

Thermal expansion matched to the design value

Changing the W:Cu ratio matches the expansion coefficient to ceramics and semiconductor chips.

03

Better machinability

TZM and La-Mo have higher high-temperature strength and recrystallization temperature than pure molybdenum.

KEY PROPERTIES

Key Properties

W-Cu

W 50–90% · 12.2–17.0 g/cm³

Thermal conductivity 180–340 W/m·K · composite for heat dissipation and electrodes

Mo-Cu

Mo 50–90% · 9.5–10.0 g/cm³

Thermal conductivity 150–270 W/m·K · helium leak ≤5×10⁻⁹ Pa·m³/s

Tungsten heavy alloy

W 90–97% · 16.9–18.9 g/cm³

ASTM B777 Class 1–4 · tensile ≥648–758 MPa, magnetic and non-magnetic

W-Ag

70:30

Composite for switching contacts

W-Re

WRe3/25 · WRe5/26

Thermocouple wire Ø0.10–1.00 mm · compensating wire included

TZM

Ti-Zr-Mo · oxygen below 50 ppm

Tensile 370 MPa at 1200°C · raised recrystallization temperature

MHC

Mo-Hf-C

A grade above TZM · tensile 300 MPa at 1400°C

La-Mo

La 0.1–2.0%

Improved high-temperature creep resistance

COMPARISON

High-temperature alloys compared

Where they stand when set alongside competing materials. The mechanical properties were tested at different temperatures for each material.

Swipe to compare all 7 materials →

Ni-based superalloy

Ni-Cr-W-Mo-Al-Ti

TiAl

Titanium aluminide

Nb-based

Nb-W-Mo-Zr

Fe-based ODS

Fe-Cr-W-Ti-Y-O

W-based

WAl

TZM

Ti-Zr-Mo

MHC

Mo-Hf-C

Physical properties

Densityg/cm³

8.9

4.54

8.57

7.86

19.3

10.13

10.23

Thermal conductivityW/m·K

—

53.7

46.5

173

135

Specific heatkJ/kg·°C

0.46

—

0.26

0.45

0.14

0.25

Thermal expansionµm/m·K

—

16~18

4.6

5.2

Melting point°C

1,453

1,669

2,468

1,535

3,422

2,623

Boiling point°C

2,800

—

4,744

2,750

5,927

5,560

Mechanical properties

Test temperature°C

1,000

470

1,600

850

1,100

1,200

1,400

Tensile strength σbMPa

170

92.3

488

370

300

Yield strength σ0.2MPa

136

81.2

70.4

—

310

283

Elongation δ%

32.9

—

The figures are for the material we supply; the comparison materials are generally accepted representative values. Test temperatures differ, so the mechanical properties are not figures taken under the same conditions.