Copper (Cu) | Korea Tungsten Co., Ltd.

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Copper

Copper has the highest electrical and thermal conductivity of any metal after silver, and it is a reddish-brown metal that combines workability with economy. It serves as a core material in power equipment, heat dissipation parts, EDM electrodes and heat exchangers.

63.546

1085Melting point °C

8.96Density g/cm³

401Thermal conductivity W/m·K

16.5Thermal expansion µm/m·K

INTRODUCTION

Copper

At 401 W/m·K it pulls heat away fast. Combined with tungsten and molybdenum, it becomes heat dissipation parts and EDM electrodes.

WCu(70:30)WCu(55:45)MoCu(50:50)

INTRODUCTION

Copper

At 401 W/m·K it pulls heat away fast. Combined with tungsten and molybdenum, it becomes heat dissipation parts and EDM electrodes.

WCu(70:30)WCu(55:45)MoCu(50:50)

WHY COPPER

The partner in composites that carries heat away

01

The highest conductivity after silver

At 401 W/m·K it conducts both heat and electricity well. It is the base material of the heat dissipation path.

02

It makes up for what refractory metals lack

Infiltrating W or Mo with Cu gives strength and thermal conductivity in one part.

03

Thermal expansion can be tuned

The W:Cu ratio sets the expansion coefficient so it can be bonded to ceramics and semiconductor chips.

KEY PROPERTIES

Key Properties

1085 °C

Melting point

A low-melting metal

8.96

Density g/cm³

Medium density

401

Thermal conductivity W/m·K

After silver

16.5

Thermal expansion µm/m·K

Relatively large

Composite

Main form of use

W-Cu · Mo-Cu composites

3 grades

Supply grades

WCu(70:30) · WCu(55:45) · MoCu

Figures are representative values. The thermal expansion coefficient is taken from published literature and needs review before release; actual delivery specifications follow the per-lot test report.

WHY COPPER

The partner in composites that carries heat away

01

The highest conductivity after silver

At 401 W/m·K it conducts both heat and electricity well. It is the base material of the heat dissipation path.

02

It makes up for what refractory metals lack

Infiltrating W or Mo with Cu gives strength and thermal conductivity in one part.

03

Thermal expansion can be tuned

The W:Cu ratio sets the expansion coefficient so it can be bonded to ceramics and semiconductor chips.

KEY PROPERTIES

Key Properties

1085 °C

Melting point

A low-melting metal

8.96

Density g/cm³

Medium density

401

Thermal conductivity W/m·K

After silver

16.5

Thermal expansion µm/m·K

Relatively large

Composite

Main form of use

W-Cu · Mo-Cu composites

3 grades

Supply grades

WCu(70:30) · WCu(55:45) · MoCu

Figures are representative values. The thermal expansion coefficient is taken from published literature and needs review before release; actual delivery specifications follow the per-lot test report.

WHY COPPER

The partner in composites that carries heat away

01

The highest conductivity after silver

At 401 W/m·K it conducts both heat and electricity well. It is the base material of the heat dissipation path.

02

It makes up for what refractory metals lack

Infiltrating W or Mo with Cu gives strength and thermal conductivity in one part.

03

Thermal expansion can be tuned

The W:Cu ratio sets the expansion coefficient so it can be bonded to ceramics and semiconductor chips.

KEY PROPERTIES

Key Properties

1085 °C

Melting point

A low-melting metal

8.96

Density g/cm³

Medium density

401

Thermal conductivity W/m·K

After silver

16.5

Thermal expansion µm/m·K

Relatively large

Composite

Main form of use

W-Cu · Mo-Cu composites

3 grades

Supply grades

WCu(70:30) · WCu(55:45) · MoCu

Figures are representative values. The thermal expansion coefficient is taken from published literature and needs review before release; actual delivery specifications follow the per-lot test report.

Comparison

Conductive metals compared

Properties

Aluminum (Al)

Silver (Ag)

Copper

Electrical conductivity (IACS %)

106

100 (the reference material)

Thermal conductivity (W/m·K)

237

429